Indium Corporation offers a number of SnPb solder pastes for circuit board assembly and high-Pb applications common in semiconductor packaging.
Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well. Solder Paste Features & Benefits Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. It has many properties that must be favorable for its good performa. Solder paste is enabling the complex electronic systems of next generation of vehicles - from power inverters and battery management to infotainment Read More Response-to-Pause: A Critical Solder Paste Parameterįolks, Solder paste is arguably the most highly engineered material in electronic assembly. Read More Bringing Solder Paste Reliability to E-Mobility Read More P Value Calculator for F Statisticsįolks, In my last post, I discussed an Excel® spreadsheet to calculate p values for hypothesis tests in which the t distribution is employed.
The next generation of virtual reality is packing a lot more technology into an even smaller space - but as material science engineers and solder manufacturers I can say with confidence we're ready. Read More Peer into the Future - Technology Required for Virtual Reality I will be giving a paper on hotbar soldering in the morning on Thursday October 12, as p. SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Solder Paste Blog Articles Join Me at SMTAI 2023įolks, This year SMTAI is in Minneapolis from October 9 to October 12.The Indium Corporation & Macartney Family Foundation.
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